60 GHz high-efficiency HEMT MMIC chip set development for high-power solid state power amplifier

IEEE MTT-S International Microwave Symposium Digest

Volumn 3, Issue , 1997, Pages 1179-1182

  Hwang, Y ^a   Lester, J ^a   Schreyer, G ^a   Zell, G ^a   Schrier, S ^a   Yamauchi, D ^a   Onak, G ^a   Kasody, B ^a   Kono, R ^a   Chen, Y C ^a   Lai, R ^a  

^a NORTHROP GRUMMAN CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

HIGH ELECTRON MOBILITY TRANSISTORS; INTEGRATED CIRCUIT MANUFACTURE; MICROPROCESSOR CHIPS; POWER AMPLIFIERS; SOLID STATE DEVICES;

SOLID STATE POWER AMPLIFIERS (SSPA);

MONOLITHIC MICROWAVE INTEGRATED CIRCUITS;

EID: 0030711807     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)