Silicon-based micromachined packages for discrete components

IEEE MTT-S International Microwave Symposium Digest

Volumn 2, Issue , 1997, Pages 521-524

  Henderson, Rashaunda M ^a   Katehi, Linda P B ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

INTEGRATED CIRCUIT LAYOUT; MICROMACHINING; PHASE SHIFTERS; SEMICONDUCTING SILICON; THICK FILM CIRCUITS;

SILICON MICROMACHINING;

ELECTRONICS PACKAGING;

EID: 0030711791     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)