Combination of different methods to characterize micromechanical sensors

Materials Research Society Symposium - Proceedings

Volumn 459, Issue , 1997, Pages 243-248

  Buchhold, R ^a   Buettner, U ^a   Nakladal, A ^a   Sager, K ^a   Hack, E ^a   Broennimann, R ^a   Sennhauser, U ^a   Schroth, A ^a  

^a DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRIC CONDUCTIVITY OF SOLIDS; ELECTRIC FIELD EFFECTS; FAILURE ANALYSIS; FINITE ELEMENT METHOD; INTERFEROMETRY; MICROELECTROMECHANICAL DEVICES; PIEZOELECTRIC DEVICES; PRESSURE MEASUREMENT; SIGNAL PROCESSING; THERMODYNAMIC PROPERTIES;

MICHELSON INTERFEROMETRY; PIEZORESISTIVE PRESSURE SENSORS;

SILICON SENSORS;

EID: 0030711227     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)