DSP cores for mobile communications: Where are we going?

ICASSP, IEEE International Conference on Acoustics, Speech and Signal Processing - Proceedings

Volumn 1, Issue , 1997, Pages 279-282

  Fettweis, Gerhard ^a  

^a DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

APPLICATION SPECIFIC INTEGRATED CIRCUITS; COMPUTER AIDED DESIGN; COMPUTER AIDED SOFTWARE ENGINEERING; COMPUTER HARDWARE; INTEGRATED CIRCUIT LAYOUT; MOBILE TELECOMMUNICATION SYSTEMS;

DIGITAL SIGNAL PROCESSORS;

DIGITAL SIGNAL PROCESSING;

EID: 0030711146     PISSN: 07367791     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)