Bottom leaded plastic (BLP) package: A new design with low-cost adhesive material

National Electronic Packaging and Production Conference-Proceedings of the Technical Program (West and East)

Volumn 2, Issue , 1997, Pages 1061-1068

  Kang, Teck Gyu ^a   Kim, Young Gon ^a   Chun, Heung Sup ^a   Cha, Ki Bon ^a   Heo, Sung Jae ^a   Shin, Myeong Jin ^a  

^a LG Semicon Advanced Packaging Group   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; COST EFFECTIVENESS; FAILURE ANALYSIS; HIGH TEMPERATURE OPERATIONS; MECHANICAL TESTING; MICROCRACKS; RELIABILITY;

BOTTOM LEADED PLASTIC (BLP) PACKAGE; CRACK RESISTANCE; DIE SHEAR; WIRE PULL;

ELECTRONICS PACKAGING;

EID: 0030710799     PISSN: 04700155     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)