Enhanced boiling heat transfer in porous layers with application to electronic component cooling

Journal of Enhanced Heat Transfer

Volumn 4, Issue 3, 1997, Pages 175-186

  Konstantinou, N D ^a   Stubos, A K ^b   Statharas, J C ^b   Kanellopoulos, N K ^a   Papaioannou, A Ch ^c  

^a INSTITUTE OF NANOSCIENCE AND NANOTECHNOLOGY   (Greece)

^b INSTITUTE OF NUCLEAR TECHNOLOGY AND RADIATION PROTECTION   (Greece)

^c NATIONAL TECHNICAL UNIVERSITY OF ATHENS   (Greece)

Author keywords

Boiling; Electronic components cooling; Enhanced heat transfer; Numerical simulation; Porous media; Two phase flow

Indexed keywords

BOILING HEAT TRANSFER ENHANCEMENT; ELECTRONIC COMPONENT COOLING;

BOILING LIQUIDS; COMPUTER SIMULATION; ELECTRONIC EQUIPMENT; HEAT FLUX; MECHANICAL PERMEABILITY; PHASE TRANSITIONS; POROSITY; POROUS MATERIALS; THERMAL CONDUCTIVITY OF SOLIDS; TWO PHASE FLOW;

HEAT TRANSFER;

EID: 0030708484     PISSN: 10655131     EISSN: None     Source Type: Journal    
DOI: 10.1615/JEnhHeatTransf.v4.i3.20     Document Type: Article

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