Mechanical stress modeling for silicon fabrication processes

International Conference on Simulation of Semiconductor Processes and Devices, SISPAD

Volumn , Issue , 1997, Pages 53-56

  Rueda, Hernan A ^a   Cea, Stephen ^a   Law, Mark E ^a  

^a UNIVERSITY OF FLORIDA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CALCULATIONS; FINITE ELEMENT METHOD; INTERFACES (MATERIALS); OXIDATION; SEMICONDUCTING FILMS; SEMICONDUCTING SILICON; STRAIN; STRESS ANALYSIS; SUBSTRATES; THERMAL EXPANSION;

BOUNDARY LOAD METHOD; DOPANT; FULLY INTEGRATED METHOD;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0030708082     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)