3.5 Gb/s×4 ch optical interconnection module for ATM switching system

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1997, Pages 210-216

  Tanaka, Nobuyuki ^a   Arai, Yoshimitsu ^a   Takahara, Hideyuki ^a   Ando, Yasuhiro ^a   Ishihara, Noboru ^a   Hino, Shigeki ^a  

^a NTT CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM COMPOUNDS; ASYNCHRONOUS TRANSFER MODE; ELECTRONICS PACKAGING; ENERGY DISSIPATION; HEAT RESISTANCE; LSI CIRCUITS; SWITCHING SYSTEMS; TRANSCEIVERS;

ALUMINUM NITRIDE CERAMIC PACKAGE; PASSIVE ALIGNMENT TECHNIQUE;

OPTICAL INTERCONNECTS;

EID: 0030708005     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)