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Volumn 293, Issue 1-2, 1997, Pages 78-82
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Film thickness variation in a cylindrical magnetron deposition device
a a |
Author keywords
Aluminium; Copper; Plasma processing and deposition; Sputtering
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Indexed keywords
ALUMINUM;
BACKSCATTERING;
COPPER;
FILM PREPARATION;
MAGNETRON SPUTTERING;
MAGNETRONS;
PLASMA APPLICATIONS;
SPUTTER DEPOSITION;
THIN FILMS;
PLASMA DEPOSITION;
METALLIC FILMS;
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EID: 0030706682
PISSN: 00406090
EISSN: None
Source Type: Journal
DOI: 10.1016/S0040-6090(96)08993-6 Document Type: Article |
Times cited : (15)
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References (17)
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