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Volumn 477, Issue , 1997, Pages 267-271
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SPFM pre-cleaning for formation of silicon interfaces by wafer bonding
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Author keywords
[No Author keywords available]
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Indexed keywords
BONDING;
CHEMICAL CLEANING;
CURRENT VOLTAGE CHARACTERISTICS;
ELECTRIC RESISTANCE MEASUREMENT;
HYDROFLUORIC ACID;
HYDROGEN PEROXIDE;
SEMICONDUCTING SILICON;
SULFURIC ACID;
SURFACE CLEANING;
SULFURIC PEROXIDE HYDROFLUORIC MIXTURE;
WAFER BONDING;
SEMICONDUCTOR JUNCTIONS;
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EID: 0030705649
PISSN: 02729172
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
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Times cited : (2)
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References (10)
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