Modeling and experimental validation of interconnects with meshed power planes

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1997, Pages 1158-1162

  Li, Y L ^a   El Sharawy, El Badawy ^a   Polka, Lesley ^a   Madrid, Anna ^a   Liao, J C ^a   Figueroa, David ^a  

^a INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC IMPEDANCE; ELECTRIC WIRING; EQUIVALENT CIRCUITS; FINITE DIFFERENCE METHOD; MATHEMATICAL MODELS; OPTIMIZATION; TIME DOMAIN ANALYSIS;

BLOCH IMPEDANCE; MESHED POWER PLANES; PLASTIC LAND GRID ARRAY (PLGA); TIME DOMAIN REFLECTOMETRY (TDR);

ELECTRONICS PACKAGING;

EID: 0030705542     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (14)