Low deformation and stress packaging of micro-machined devices

IEE Colloquium (Digest)

Volumn , Issue 4, 1997, Pages

  Dickerson, Terry ^a   Ward, Michael ^b  

^a TWI LTD   (United Kingdom)

^b DEFENCE SCIENCE AND TECHNOLOGY LABORATORY   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; COMPUTER SIMULATION; DEFORMATION; DIES; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; SILICON; THERMAL EXPANSION;

LOW DEFORMATION PACKAGING; MICROMACHINED DEVICES;

ELECTRONICS PACKAGING;

EID: 0030700973     PISSN: 09633308     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (3)

1. Dickerson, T: "Modelling of Microengineered Components: A Practical Perspective On Properties Of Materials Measurement". IEE Seminar on Methods of Materials Measurement in Microengineering, December 1995.
2. Timoshenko, S: "Analysis of Bi-metal Thermostats", JOSA and RSI, September 1925.
3. Suhir, E: "Die Attachment design and its Influence on Thermal Stresses in the Die and the Attachment", IEEE Paper No. 0569-5503/97/0000-0508, 1987.