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Volumn , Issue , 1997, Pages 632-637
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Assembly and wiring technologies on PLC platforms for low-cost and high-speed applications
a a a a
a
NTT CORPORATION
(Japan)
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Author keywords
[No Author keywords available]
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Indexed keywords
BANDWIDTH;
ELECTRONICS PACKAGING;
FREQUENCY DIVISION MULTIPLEXING;
OPTICAL COMMUNICATION;
SOLDERING;
TELECOMMUNICATION LINES;
THIN FILMS;
TRANSCEIVERS;
PLANAR LIGHTWAVE CIRCUITS (PLC);
THIN FILM SOLDER;
OPTOELECTRONIC DEVICES;
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EID: 0030699755
PISSN: 05695503
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (13)
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References (12)
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