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Volumn , Issue , 1997, Pages 632-637

Assembly and wiring technologies on PLC platforms for low-cost and high-speed applications

Author keywords

[No Author keywords available]

Indexed keywords

BANDWIDTH; ELECTRONICS PACKAGING; FREQUENCY DIVISION MULTIPLEXING; OPTICAL COMMUNICATION; SOLDERING; TELECOMMUNICATION LINES; THIN FILMS; TRANSCEIVERS;

EID: 0030699755     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (13)

References (12)
  • Reference 정보가 존재하지 않습니다.

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.