Integration of environmental factors in process modeling for printed circuit board manufacturing, Part I: assembly

IEEE International Symposium on Electronics & the Environment

Volumn , Issue , 1997, Pages 218-225

  Worhach, P ^a   Sheng, P ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY; ENVIRONMENTAL IMPACT; MATHEMATICAL MODELS; PLANNING; PRINTED CIRCUIT DESIGN; SOLDERING; SURFACE MOUNT TECHNOLOGY;

ENVIRONMENTAL FACTORS; PROCESS PARAMETERS;

PRINTED CIRCUIT BOARDS;

EID: 0030698537     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)