Holographic assessment of edge delamination on foam-adhesive bonded joints

Composites Part B: Engineering

Volumn 28, Issue 3, 1997, Pages 177-183

  Qin, S ^a   Shang, H M ^a   Giam, C L ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

Adhesive bonded joints; B. adhesion; C. delamination; D. non destructive testing

Indexed keywords

ADHESION; ADHESIVE JOINTS; ADHESIVES; BONDING; DELAMINATION; FOAMS; HOLOGRAPHY; ITERATIVE METHODS; NONDESTRUCTIVE EXAMINATION;

CANTILEVER BARS;

LAMINATED COMPOSITES;

EID: 0030688749     PISSN: 13598368     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-8368(96)00054-6     Document Type: Article

References (12)

1. Erf, R.K. in 'Holographic Nondestructive Testing'. Academic Press. New York, 1974.
2. Vest. C.M. in 'Holographic Interferometry'. John Wiley, New York, 1979.
3. Hung, Y.Y. Opt. Engng, 1982, 21(3), 391-395.
4. Rubayi, N.A. and Liew, S.H. Exp. Tech., 1989, 13, 17-20.
5. Shang, H.M., Toh, S.L., Chau, F.S., Shim, V.P.W. and Tay, C.J. ASME Trans. J. Engng Mater. Technol., 1991, 113, 99-103.
6. Shang, H.M., Toh, S.L., Chau, F.S., Tay, C.J. and Tay, T.E. J. Nondestr. Eval., 1991, 10(1), 7-17.
7. Shang, H.M., Chau, F.S., Tay, C.J., Toh, S.L. and Tham, L.M. Compos. Engng, 1994, 4(2), 233-245.
8. Shang, H.M., Tham, L.M. and Chau, F.S. ASME Trans. J. Engng Mater. Technol., 1995, 117(3), 322-329.
9. Liechti, K.M. and Hanson, E.C. in 'Adhesively Bonded Joints: Testing, Analysis, and Design', ASTM STP981 (ed. W.S. Johnson), American Society for Testing and Materials, Philadephia, PA, 1988.
10. Goland, M. and Reissner, E. ASME Trans. J. Appl. Mech., 1944, 66, A17-A27.
11. Qin, S, Shang, H.M., Tee, C.E. and Liu, W. Optics Lasers Engng, 1996, 25(2-3), 141-161.
12. Hetényi, M. in 'Beams On Elastic Foundation'. University of Michigan Press, Ann Arbor, MI, 1946