New robust small radius joints based on thermal shrinkage of polyimide in V-grooves

International Conference on Solid-State Sensors and Actuators, Proceedings

Volumn 1, Issue , 1997, Pages 675-678

  Ebefors, Thorbjorn ^a   Kalvesten, Edvard ^a   Vieider, Christian ^a   Stemme, Goran ^a  

^a ROYAL INSTITUTE OF TECHNOLOGY   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CONNECTORS; POLYIMIDES; SEMICONDUCTOR DEVICE MANUFACTURE; SHRINKAGE; SILICON WAFERS; THERMAL EFFECTS;

THERMAL SHRINKAGE;

MICROELECTROMECHANICAL DEVICES;

EID: 0030688631     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)