Direct writing and lift-off patterning of copper lines at 200 °C maximum process temperature

Materials Research Society Symposium - Proceedings

Volumn 471, Issue , 1997, Pages 35-40

  Hong, C M ^a   Gleskova, H ^a   Wagner, S ^a  

^a PRINCETON UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; COPPER COMPOUNDS; DECOMPOSITION; DEPOSITION; ELECTRIC CONDUCTIVITY OF SOLIDS; GLASS; HYDROGEN; MASKS; METALLIZING; ORGANOMETALLICS; SUBSTRATES; ULTRAVIOLET RADIATION;

COPPER HEXANOATE; DIRECT WRITING; LIFT OFF PATTERNING TECHNIQUES;

COPPER;

EID: 0030688544     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-471-35     Document Type: Conference Paper

References (40)