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Volumn , Issue , 1997, Pages 905-910
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Feasibility study of laser microwelding of high density cable assemblies with applications to portable electronics
a
a
AMP Inc
(United States)
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Author keywords
[No Author keywords available]
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Indexed keywords
ASSEMBLY;
COPPER ALLOYS;
ELECTRIC CONNECTORS;
ELECTRIC CONTACTS;
ELECTRIC WIRE;
LASER BEAM WELDING;
MICROSCOPIC EXAMINATION;
PULSED LASER APPLICATIONS;
SCANNING ELECTRON MICROSCOPY;
TENSILE STRENGTH;
TENSILE TESTING;
WELDS;
HIGH DENSITY CABLE ASSEMBLY;
LASER MICROWELDING;
NANOINDENTATION CHARACTERIZATION;
PORTABLE ELECTRONICS;
ELECTRONICS PACKAGING;
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EID: 0030687838
PISSN: 05695503
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
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Times cited : (4)
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References (16)
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