High frequency package design technology using S parameter synthesize method

Annual Wireless Communications Conference, Proceedings

Volumn , Issue , 1997, Pages 151-155

  Wada, Hisayoshi ^a   Makihara, Chihiro ^a   Park, Chong il ^a  

^a KYOCERA CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; COMPUTER SIMULATION; ELECTRIC NETWORK PARAMETERS; ELECTRIC NETWORK SYNTHESIS; MICROWAVE DEVICES; MULTICHIP MODULES; SEMICONDUCTOR DEVICE MANUFACTURE;

HIGH FREQUENCY PACKAGE DESIGN TECHNOLOGY; S PARAMETER MEASUREMENT;

ELECTRONICS PACKAGING;

EID: 0030685873     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)