Hot water etching of silicon surfaces: New insights of mechanistic understanding and implications to device fabrication

Materials Research Society Symposium - Proceedings

Volumn 477, Issue , 1997, Pages 181-190

  Rosamilia, J M ^a   Boone, T ^a   Sapjeta, J ^a   Raghavachari, K ^a   Higashi, G S ^a   Liu, Q ^a  

^a NOKIA RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL ATTACK; COMPOSITION EFFECTS; CONTACT ANGLE; DISSOLUTION; ETCHING; OXYGEN; ROUGHNESS MEASUREMENT; SEMICONDUCTOR DEVICE MANUFACTURE; SURFACE CLEANING; THERMAL EFFECTS;

HOT WATER ETCHING;

SILICON WAFERS;

EID: 0030683272     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)