New pick up & release method by heating for micromanipulation

Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 1997, Pages 383-388

  Arai, Fumihito ^a   Fukuda, Toshio ^a  

^a NAGOYA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

END EFFECTORS; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; PRESSURE EFFECTS; SEMICONDUCTING SILICON; THERMAL EFFECTS;

MICROMANIPULATORS;

MANIPULATORS;

EID: 0030679954     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)