New frontside-release etch-diffusion process for the fabrication of thick Si microstructures

International Conference on Solid-State Sensors and Actuators, Proceedings

Volumn 2, Issue , 1997, Pages 1435-1438

  Weigold, Jason W ^a   Pang, Stella W ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; BORON; DIFFUSION; DRY ETCHING; MICROSTRUCTURE; NATURAL FREQUENCIES; SEMICONDUCTOR JUNCTIONS; SINGLE CRYSTALS;

DEEP ETCHING; ETCH DIFFUSION; ETHYLENEDIAMINE PYROCATECHOL; FRONTSIDE RELEASE PROCESS;

SILICON WAFERS;

EID: 0030678712     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)