Effect of oxides on the adhesion of Cu films deposited onto stainless steel by electron shower and thermal evaporation methods

Journal of Adhesion Science and Technology

Volumn 11, Issue 5, 1997, Pages 665-677

  Yumoto, H ^a   Shimada, S ^a   Minami, C ^a   Inoue, T ^a   Li, S J ^a   Ishihara, M ^a  

^a TOKYO UNIVERSITY OF SCIENCE   (Japan)

Author keywords

Adhesion; Cu film; Electron showcr; Oxide; Stainless steel; XPS

Indexed keywords

EFFECTS; EPOXY RESINS; INTERFACES (MATERIALS); OXIDES; STAINLESS STEEL; SUBSTRATES; THERMAL DIFFUSION; X RAY PHOTOELECTRON SPECTROSCOPY; CHEMICAL BONDS; ETCHING; METALLIC FILMS; THERMAL EVAPORATION;

COPPER FILMS; ELECTRON SHOWER; ETCHING RATE; THERMAL EVAPORATION METHODS;

ADHESION;

CHEMICAL BONDINGS; CU FILM; CU FILMS; CU OXIDE; DEPOSITION METHODS; DEPTH PROFILE; ETCHING RATE; OXYGEN GAS; PRE-TREATMENT; STAINLESS STEEL SUBSTRATES; SUBSTRATE TEMPERATURE; THERMAL EVAPORATION METHOD; VACUUM CHAMBERS;

EID: 0030678360     PISSN: 01694243     EISSN: 15685616     Source Type: Journal    
DOI: 10.1163/156856197X00651     Document Type: Article

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