Comparison of Ni/Au, Pd/Au, Cr/Au metallizations for ohmic contacts to p-GaN

Materials Research Society Symposium - Proceedings

Volumn 449, Issue , 1997, Pages 1091-1096

  Trexler, J T ^a   Pearton, S J ^a   Holloway, P H ^a   Mier, M G ^a   Evans, K R ^a   Karlicek, R F ^a  

^a UNIVERSITY OF FLORIDA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CARRIER CONCENTRATION; CHROMIUM; ELECTRIC RESISTANCE; GOLD; METALLIZING; NICKEL; PALLADIUM; SEMICONDUCTING GALLIUM COMPOUNDS; THIN FILMS;

CONDUCTION MECHANISMS; METAL THIN FILMS; NITRIDE SEMICONDUCTORS;

OHMIC CONTACTS;

EID: 0030677098     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (16)