Computational fluid dynamic and heat transfer analysis of an Al/SiC IGBT power hybrid package

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn , Issue , 1997, Pages 169-172

  Fusaro, James M ^a   Rodriguez, Pablo ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; BIPOLAR TRANSISTORS; COMPUTATIONAL FLUID DYNAMICS; ELECTRIC VEHICLES; FINITE DIFFERENCE METHOD; HEAT SINKS; HEAT TRANSFER; OPTIMIZATION; POWER ELECTRONICS; SEMICONDUCTOR DIODES; SILICON CARBIDE;

ELECTRIC POWER TRAIN; FREE WHEELING DIODES; INSULATED GATE BIPOLAR TRANSISTORS; POWER HYBRID PACKAGE;

ELECTRONICS PACKAGING;

EID: 0030676680     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (5)