Modular environment for the design of micromachined silicon devices

International Conference on Solid-State Sensors and Actuators, Proceedings

Volumn 2, Issue , 1997, Pages 1023-1026

  Steffensen, L ^a   Than, O ^a   Buettgenbach, S ^a  

^a TECHNICAL UNIVERSITY OF BRAUNSCHWEIG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER AIDED DESIGN; ETCHING; FINITE ELEMENT METHOD; MICROMACHINING; THREE DIMENSIONAL;

ETCH SIMULATION; MICROMACHINED SILICON DEVICES; MODULAR ENVIRONMENT; PRODUCT MODEL;

SEMICONDUCTING SILICON;

EID: 0030675961     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)