Improvement of solder joint reliability between multilayer ceramic package and printed wiring board

Proceedings of the IEEE/CPMT International Electronic Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 1997, Pages 342-347

  Yamaguchi, Kouichi ^a   Higashi, Masahiko ^a   Hamada, Noriaki ^a   Yonekura, Hideto ^a   Oike, Satoshi ^a   Kunimatsu, Yasuyoshi ^a  

^a KYOCERA CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; CERAMIC MATERIALS; COMPUTER SIMULATION; ELASTIC MODULI; FINITE ELEMENT METHOD; PRINTED CIRCUIT BOARDS; RELIABILITY; SOLDERED JOINTS; STRESS ANALYSIS; STRESS RELAXATION; THERMAL CYCLING; THERMAL EXPANSION;

BALL GRID ARRAY (BGA) PACKAGES;

ELECTRONICS PACKAGING;

EID: 0030675726     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)