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Volumn , Issue , 1997, Pages 383-388
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`Miniaturization of chip inductors using multilayer technology and its application as chip components for high frequency power modules'
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Author keywords
[No Author keywords available]
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Indexed keywords
MOBILE TELECOMMUNICATION SYSTEMS;
MULTILAYERS;
SUBSTRATES;
MINIATURIZATION;
POWER MODULES;
ELECTRIC INDUCTORS;
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EID: 0030675725
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (9)
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References (2)
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