Analyzing residues using AC impedance techniques

National Electronic Packaging and Production Conference-Proceedings of the Technical Program (West and East)

Volumn 3, Issue , 1997, Pages 1270-1279

  Guy, John ^a   Frederickson, Mike ^a  

^a American Competitiveness Institute   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC IMPEDANCE MEASUREMENT; INTERFACES (MATERIALS);

FLUX RESIDUE MATERIALS;

SPECTROSCOPY;

EID: 0030674874     PISSN: 04700155     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (0)