Copper integration in self aligned Dual Damascene architecture

Digest of Technical Papers - Symposium on VLSI Technology

Volumn , Issue , 1997, Pages 31-32

  Morand, Y ^a   Lerme, M ^a   Palleau, J ^a   Torres, J ^a   Vinet, F ^a   Demolliens, O ^a   Ulmer, L ^a   Gobil, Y ^a   Fayolle, M ^a   Romagna, F ^a   Le Bihan, R ^a  

^a STMICROELECTRONICS   (Italy)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; DIFFUSION IN SOLIDS; METALLIZING; MICROPROCESSOR CHIPS; TITANIUM NITRIDE;

SELF ALIGNED DUAL DAMASCENE;

CMOS INTEGRATED CIRCUITS;

EID: 0030673587     PISSN: 07431562     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/vlsit.1997.623680     Document Type: Conference Paper

References (3)