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Volumn , Issue , 1997, Pages 226-229
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Cyanide-free electroless gold bath for bonding
a a
a
Meltex Inc
(Japan)
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Author keywords
[No Author keywords available]
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Indexed keywords
BOND STRENGTH (MATERIALS);
BONDING;
CYANIDES;
DECOMPOSITION;
ELECTRODEPOSITION;
ELECTROLESS PLATING;
OXIDATION;
SULFUR COMPOUNDS;
ASCORBIC ACIDS;
ELECTROLESS GOLD BATH;
THIOCYANATE;
GOLD PLATING;
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EID: 0030661283
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (2)
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References (1)
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