Microstructure and adhesion in Al and AlN thin film system

Proceedings of the IEEE/CPMT International Electronic Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 1997, Pages 133-136

  Amamoto, Yoshiki ^a   Uchiyama, Shingo ^a   Watanabe, Yoshihisa ^a   Nakamura, Yoshikazu ^a  

^a NATIONAL DEFENSE ACADEMY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ALUMINUM; BOND STRENGTH (MATERIALS); CRYSTAL MICROSTRUCTURE; METALLIC FILMS; NITRIDES; SCANNING ELECTRON MICROSCOPY; SILICON WAFERS; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS; X RAY PHOTOELECTRON SPECTROSCOPY; X RAY SPECTROSCOPY;

ALUMINUM NITRIDE; ENERGY DISPERSIVE X RAY SPECTROSCOPY (EDX); ION BEAM ASSISTED DEPOSITION METHOD (IBAD);

THIN FILMS;

EID: 0030660899     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (14)