Magnetic thin film head with controlled domain structure by electroplating technology

Electrochimica Acta

Volumn 42, Issue 20-22, 1997, Pages 3361-3366

  Shinoura, O ^a   Koyanagi, T ^a  

^a TDK CORPORATION   (Japan)

Author keywords

Domain structure; Electroplated NiFe film; Magnetic anisotropy; Thin film head

Indexed keywords

ANNEALING; CREEP; ELECTROPLATING; FINITE ELEMENT METHOD; MAGNETIC ANISOTROPY; MAGNETIC CORES; MAGNETIC DOMAINS; MAGNETIC THIN FILM DEVICES; NICKEL COMPOUNDS; PLASTIC DEFORMATION; STRESS CONCENTRATION;

MAGNETIZATION DISTRIBUTION;

MAGNETIC HEADS;

EID: 0030660807     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0013-4686(97)00188-6     Document Type: Article

References (39)

1. D. P. Gregg, U.S. Patent, 3344237 (1967).
2. L. T. Romankiw, I. M. Croll and M. Hatzakis, IEEE Trans. Magn. MAG-6, 597 (1970).
3. J. P. Lazzari and I. Melnick, IEEE Trans. Magn. MAG-7, 146 (1971).
4. P. C. Andricacos, L. T. Romankiw, in Advances in Electrochemical Science and Engineering (Edited by H. Gerischer and C. W. Tobias), Vol. 3, p. 227, VCH, Germany (1990).
5. R. E. Fontana, Proc. of the Symp. on Magnetic Materials, Processes, and Devices, Electrochem. Soc. PV90-8, 205 (1990).
6. O. Shinoura, in Electrochemical Technology (Edited by N. Mashuko, T. Osaka and Y. Ito), p. 219, Kodansha and Gordon and Breach, Tokyo (1996).
7. M. Hanazono, S. Narishige, S. Hara, K. Mitsuoka, K. Kawakami and Y. Sugita, J. Appl. Phys. 61, 4157 (1987).
8. L. T. Romankiw, U.S. Patent, 3853715 (1974).
9. L. T. Romankiw and P. Simon, IEEE Trans. Magn. MAG-11, 50 (1975).
10. E. C. Hume, W. M. Deen and R. A. Brown, J. Electrochem. Soc. 131, 1251 (1984).
11. I. W. Wolf, V. P. McConnell, Tech. Proc. Am. Electroplaters, 43, 215 (1956).
12. I. W. Wolf, J. Electrochem. Soc. 108, 959 (1961).
13. S. H. Liao and S. E. Anderson, J. Electrochem. Soc. 140, 208 (1993).
14. H. Dahms and I. M. Croll, J. Electrochem. Soc. 112, 771 (1965).
15. J. P. Horkans, J. Electrochem. Soc. 126, 1861 (1979).
16. P. C. Andricacos and H. Y. Cheh, J. Electrochem. Soc. 128, 838 (1981).
17. J. P. Horkans, J. Electrochem. Soc. 128, 45 (1981).
18. H. Deligianni and L. T. Romankiw, Proc. of the Symp. on Magnetic Materials, Processes, and Devices, Electrochem. Soc. PV90-8, 423 (1990).
19. H. Deligianni and L. T. Romankiw, Proc. of the Symp. on Magnetic Materials, Processes, and Devices, Electrochem. Soc. PV90-8, 407 (1990).
20. S. Narishige, M. Hanazono and M. Takagi, J. Mag. Soc. Jpn 8, 65 (1984).
21. S. Klokholm and Krongelb, Proc. of the Symp. of Magnetic Materials, Processes, and Devices, Electrochem. Soc. PV90-8, 125 (1990).
22. R. E. Jones, IEEE Trans. Magn. MAG-15, 1619 (1979).
23. M. Williams and S. Lambert, IEEE Trans. Magn. MAG-25, 3206 (1989).
24. P. Kasiraj and R. D. Holmes, J. Appl. Phys. 69, 5423 (1991).
25. F. H. Liu, M. D. Schultz and M. H. Kryder, J. Appl. Phys. 69, 5414 (1991).
26. S. Narishige, K. Mitsuoka, M. Hanazono, M. Takagi and T. Yoshida, J. Mag. Soc. Jpn 7, 99 (1983).
27. S. Mitani, N. Echigo, K. Nakamura and N. Kaminaka, J. Mag. Soc. Jpn 12, 255 (1988).
28. H. J. Williams, Phys. Rev. 80, 1090 (1950).
29. R. D. Hempstead, J. B. Money, U.S. Patent, 4242710 (1979).
30. M. Hanazono, S. Narishige, K. Kawakami, N. Saito and M. Takagi, J. Appl. Phys. 53, 2608 (1982).
31. S. H. Liao, IEEE Trans. Magn. 26, 328 (1990).
32. L. T. Romankiw, IBM Technical Disclosure Bulletin 23, 2584 (1980).
33. H. Koyanagi, R. Arai, K. Mitsuoka, H. Fukui, S. Narishige and Y. Sugita, J. Mag. Soc. Jpn 13, 103 (1989).
34. K. Young, Proc. of the Symp. on Magnetic Materials, Process, and Devices, Electrochem. Soc. PV90-8, 137 (1990).
35. P. Kasiraj, R. M. Shelby, J. S. Best and D. E. Home, IEEE Trans. Magn. MAG-22, 837 (1986).
36. J. S. Y. Feng and D. A. Thompson, IEEE Trans. Magn. MAG-13, 1521 (1977).
37. J. Kishigami, T. Mikazuki and Y. Koshimoto, IEEE Trans. Magn. MAG-22, 1840 (1986).
38. C. Saka, K. Shiiki and K. Shinagawa, J. Appl. Phys. 68, 263 (1990).
39. M. H. Seavey and P. E. Tannenwald, J. Appl. Phys. 30, 227 s (1959).