Technique for measuring slurry-flow dynamics during chemical-mechanical polishing

Materials Research Society Symposium - Proceedings

Volumn 447, Issue , 1997, Pages 95-100

  Coppeta, J ^a   Rogers, C ^a   Philipossian, A ^a   Kaufman, F ^a  

^a TUFTS UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AGING OF MATERIALS; COSTS; DYES; ELECTRONICS INDUSTRY; FLOW PATTERNS; MIXING; SEMICONDUCTOR DEVICE MANUFACTURE; SILICON WAFERS; SLURRIES; THERMAL GRADIENTS; TOXICITY; VISCOSITY;

CHEMICAL MECHANICAL POLISHING; FLUORESCENT DYES; PLANARIZATION;

CHEMICAL POLISHING;

EID: 0030659914     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)