Physical properties of EMC(epoxy molding compounds) reinforced with AlN(aluminum nitride)

Annual Technical Conference - ANTEC, Conference Proceedings

Volumn 2, Issue , 1997, Pages 1438-1442

  Kim, Wonho ^a   Bae, Jonkowoo ^a  

^a Pusan National University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM COMPOUNDS; EPOXY RESINS; HEAT LOSSES; PERMITTIVITY; PLASTICS MOLDING; SILICON WAFERS; THERMAL CONDUCTIVITY OF SOLIDS; THERMAL EXPANSION; VLSI CIRCUITS;

ALUMINUM NITRIDES; EPOXY MOLDING COMPOUNDS; THERMAL EXPANSION COEFFICIENT;

NONMETALLIC MATRIX COMPOSITES;

EID: 0030655616     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)