Flip-chip high efficiency X-band HPA

IEEE MTT-S International Microwave Symposium Digest

Volumn 2, Issue , 1997, Pages 889-892

  Cameron, P ^a   Pan, W ^a   Hanz, C ^a   Nicklaus, R ^a   Chu, P ^a   Wong, D ^a   Cisco, T ^a  

^a RAYTHEON COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COST EFFECTIVENESS; FLIP CHIP DEVICES; HIGH ELECTRON MOBILITY TRANSISTORS; INTEGRATED CIRCUIT LAYOUT; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS;

HIGH POWER AMPLIFIERS;

POWER AMPLIFIERS;

EID: 0030655410     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)