Properties of thermosetting polymers during cure

Annual Technical Conference - ANTEC, Conference Proceedings

Volumn 1, Issue , 1997, Pages 766-773

  Theriault, Richard ^a   Osswald, Tim A ^a   Stradin, Linards ^a  

^a UNIVERSITY OF WISCONSIN MADISON   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; CURING; DIFFERENTIAL SCANNING CALORIMETRY; MATHEMATICAL MODELS; POLYESTERS; RESIDUAL STRESSES; RHEOLOGY;

DYNAMIC MECHANICAL ANALYSIS;

THERMOSETS;

EID: 0030654966     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (15)