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1
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0001341337
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Photolithography at 193 nm
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For earlier reviews, see (a) M. Rothschild, R. B. Goodman, M. A. Hartney, M. W. Horn, R. R. Kunz, J. H. C. Sedlacek, and D. C. Shaver, "Photolithography at 193 nm," J. Vac. Sci. Technol. B 10, 2989 (1992); (b) M. Hibbs, R. R. Kunz, and M. Rothschild, "193-nm Lithography at MIT Lincoln Lab," Solid State Technol. 38, No. 7, 69 (1995).
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Rothschild, M.1
Goodman, R.B.2
Hartney, M.A.3
Horn, M.W.4
Kunz, R.R.5
Sedlacek, J.H.C.6
Shaver, D.C.7
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2
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0029342243
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193-nm Lithography at MIT Lincoln Lab
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For earlier reviews, see (a) M. Rothschild, R. B. Goodman, M. A. Hartney, M. W. Horn, R. R. Kunz, J. H. C. Sedlacek, and D. C. Shaver, "Photolithography at 193 nm," J. Vac. Sci. Technol. B 10, 2989 (1992); (b) M. Hibbs, R. R. Kunz, and M. Rothschild, "193-nm Lithography at MIT Lincoln Lab," Solid State Technol. 38, No. 7, 69 (1995).
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Solid State Technol.
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Hibbs, M.1
Kunz, R.R.2
Rothschild, M.3
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3
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0026400581
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Argon Fluoride Excimer Laser Source for Sub-0.25-μm Optical Lithography
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R. Sandstrom, "Argon Fluoride Excimer Laser Source for Sub-0.25-μm Optical Lithography," Proc. SPIE 1463, 610-616 (1991).
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Sandstrom, R.1
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4
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0342655956
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Optical Materials for Excimer Laser Applications
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M. Rothschild, "Optical Materials for Excimer Laser Applications," Opt. Photon. News 4, No. 5, 8 (1993).
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Opt. Photon. News
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Rothschild, M.1
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5
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36549097579
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2 Molecules Dissolved in Synthetic Silica Glasses and Their Photochemical Reactions Induced by ArF Excimer Laser Radiation
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2 Molecules Dissolved in Synthetic Silica Glasses and Their Photochemical Reactions Induced by ArF Excimer Laser Radiation," J. Appl. Phys. 68, 3584 (1990).
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Awazu, K.1
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6
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0024302269
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Calcium Aluminate Glasses as Potential Ultralow-Loss Optical Materials at 1.5-1.9 μm
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M. E. Lines, J. B. MacChesney, K. B. Lyons, A. J. Bruce, A. E. Miller, and K. Nassou, "Calcium Aluminate Glasses as Potential Ultralow-Loss Optical Materials at 1.5-1.9 μm" J. Non-Cryst. Solids 107, 251 (1989).
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7
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0027879759
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Excimer Laser Degradation in Bulk Fused Silica
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M. Rothschild and J. H. C. Sedlacek, "Excimer Laser Degradation in Bulk Fused Silica," Proc. SPIE 1848, 537 (1992).
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(1992)
Proc. SPIE
, vol.1848
, pp. 537
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Rothschild, M.1
Sedlacek, J.H.C.2
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8
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0005254697
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Deep-Ultraviolet Damage to Fused Silica
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R. Schenker, P. Schermerhorn, and W. G. Oldham, "Deep-Ultraviolet Damage to Fused Silica," J. Vac. Sci. Technol. B 12, 3275 (1994).
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Schenker, R.1
Schermerhorn, P.2
Oldham, W.G.3
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9
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0001107758
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Dependence of the Damage and Transmission Properties of Fused Silica Fibers on the Excimer Laser Wavelength
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R. S. Taylor, K. E. Leopold, R. K. Brimacombe, and S. Mihailov, "Dependence of the Damage and Transmission Properties of Fused Silica Fibers on the Excimer Laser Wavelength," Appl. Opt. 27, 3124-3134 (1988).
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Taylor, R.S.1
Leopold, K.E.2
Brimacombe, R.K.3
Mihailov, S.4
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10
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0028740293
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Intensity-Dependent Transmission Properties of Window Materials at 193-nm Irradiation
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O. Kittelman and J. Ringling, "Intensity-Dependent Transmission Properties of Window Materials at 193-nm Irradiation," Opt. Lett. 19, 2053 (1994).
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Opt. Lett.
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Kittelman, O.1
Ringling, J.2
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11
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0027151565
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Optical Materials for Use with Excimer Lasers
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J. H. C. Sedlacek and M. Rothschild, "Optical Materials for Use with Excimer Lasers," Proc. SPIE 1835, 80 (1992).
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(1992)
Proc. SPIE
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Sedlacek, J.H.C.1
Rothschild, M.2
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12
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4043085966
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Laser Induced Damage in Pellicles at 193 nm
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M. Rothschild and J. H. C. Sedlacek, "Laser Induced Damage in Pellicles at 193 nm," Proc. SPIE 1674, 618 (1992).
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(1992)
Proc. SPIE
, vol.1674
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Rothschild, M.1
Sedlacek, J.H.C.2
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13
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0000875225
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High Performance Acrylic Polymers for Chemically Amplified Photoresist Applications
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R. D. Allen, G. M. Wallraff, W. D. Hinsberg, and L. L. Simpson, "High Performance Acrylic Polymers for Chemically Amplified Photoresist Applications," J. Vac. Sci. Technol. B 9, 3357-3361 (1991).
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J. Vac. Sci. Technol. B
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Allen, R.D.1
Wallraff, G.M.2
Hinsberg, W.D.3
Simpson, L.L.4
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14
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2842567164
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Acid-Catalyzed Single-Layer Resists for ArF Lithography
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R. R. Kunz, R. D. Allen, W. D. Hinsberg, and G. M. Wallraff, "Acid-Catalyzed Single-Layer Resists for ArF Lithography," Proc. SPIE 1925, 167 (1993).
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Kunz, R.R.1
Allen, R.D.2
Hinsberg, W.D.3
Wallraff, G.M.4
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15
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0001865485
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Design Considerations for 193 nm Positive Resists
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R. D. Allen, G. M. Wallraff, R. A. DiPietro, D. C. Hofer, and R. R. Kunz, "Design Considerations for 193 nm Positive Resists," Proc. Amer. Chem. Soc. Natl. Symp. 72, 100 (1995).
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Allen, R.D.1
Wallraff, G.M.2
DiPietro, R.A.3
Hofer, D.C.4
Kunz, R.R.5
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16
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0021460244
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The Scope and Mechanism of New Positive Tone Gas Phase Functionalized Plasma Developed Resists
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T. M. Wolf, G. N. Taylor, T. Venkatesan, and R. R. Kraetsch, "The Scope and Mechanism of New Positive Tone Gas Phase Functionalized Plasma Developed Resists," J. Electrochem. Soc. 131, 1664-1670 (1984).
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Wolf, T.M.1
Taylor, G.N.2
Venkatesan, T.3
Kraetsch, R.R.4
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17
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0000140214
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Silylation Processes Based on Ultraviolet Laser-Induced Crosslinking
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M. A. Hartney, M. Rothschild, R. R. Kunz, D. J. Ehrlich, and D. C. Shaver, "Silylation Processes Based on Ultraviolet Laser-Induced Crosslinking," J. Vac. Sci. Technol. B 8, 1476 (1990).
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(1990)
J. Vac. Sci. Technol. B
, vol.8
, pp. 1476
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Hartney, M.A.1
Rothschild, M.2
Kunz, R.R.3
Ehrlich, D.J.4
Shaver, D.C.5
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18
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85045186739
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Materials Evaluation of Antireflective Coatings for Single-Layer 193-nm Lithography
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R. R. Kunz and R. D. Allen, "Materials Evaluation of Antireflective Coatings for Single-Layer 193-nm Lithography," Proc. SPIE 2195, 447 (1994).
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(1994)
Proc. SPIE
, vol.2195
, pp. 447
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Kunz, R.R.1
Allen, R.D.2
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19
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0001562816
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Wet-Developed Bilayer Resists for 193-nm Excimer Laser Lithography
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R. R. Kunz, M. W. Horn, P. A. Bianconi, D. A. Smith, and J. R. Eschelman, "Wet-Developed Bilayer Resists for 193-nm Excimer Laser Lithography," J. Vac. Sci. Technol. B 10, 2554 (1992).
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J. Vac. Sci. Technol. B
, vol.10
, pp. 2554
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Kunz, R.R.1
Horn, M.W.2
Bianconi, P.A.3
Smith, D.A.4
Eschelman, J.R.5
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20
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0000135515
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Plasma-Deposited Organosilicon Thin Films as Dry Resists for Deep Ultraviolet Lithography
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M. W. Horn, S. W. Pang, and M. Rothschild, "Plasma-Deposited Organosilicon Thin Films as Dry Resists for Deep Ultraviolet Lithography," J. Vac. Sci. Technol. B 8, 1493 (1990).
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J. Vac. Sci. Technol. B
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, pp. 1493
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Horn, M.W.1
Pang, S.W.2
Rothschild, M.3
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21
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0029214514
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All-Dry Resist Processes for 193-nm Lithography
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M. W. Horn, B. E. Maxwell, R. R. Kunz, M. S. Hibbs, L. M. Eriksen, S. C. Palmateer, and A. R. Forte, "All-Dry Resist Processes for 193-nm Lithography," Proc. SPIE 2438, 760 (1995).
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Horn, M.W.1
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Palmateer, S.C.6
Forte, A.R.7
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