Via delamination - a novel electromigration failure mechanism

Annual Proceedings - Reliability Physics (Symposium)

Volumn , Issue , 1997, Pages 206-210

  Lee, Y H ^a   Wu, K ^a   Mielke, N ^a   Ma, L J ^a   Hui, S ^a  

^a INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DELAMINATION; DIELECTRIC PROPERTIES OF SOLIDS; ELECTROMIGRATION; FAILURE ANALYSIS; INTERCONNECTION NETWORKS; RELIABILITY;

ELECTROMIGRATION FAILURE MECHANISM;

MICROPROCESSOR CHIPS;

EID: 0030653678     PISSN: 00999512     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (15)