ATPG for heat dissipation minimization during scan testing

Proceedings - Design Automation Conference

Volumn , Issue , 1997, Pages 614-619

  Wang, Seongmoon ^a   Gupta, Sandeep K ^a  

^a UNIVERSITY OF SOUTHERN CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FLIP FLOP CIRCUITS; HEAT LOSSES; MULTICHIP MODULES; SEQUENTIAL CIRCUITS; STANDARDS;

AUTOMATIC TEST PATTERN GENERATION; DESIGN FOR TESTABILITY TECHNIQUES; SCAN TESTING;

INTEGRATED CIRCUIT TESTING;

EID: 0030651684     PISSN: 0738100X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1145/266021.266298     Document Type: Conference Paper

References (12)