(110) Silicon etching for high aspect ratio comb structures

IEEE Symposium on Emerging Technologies & Factory Automation, ETFA

Volumn , Issue , 1997, Pages 248-252

  Kim, Seong Hyok ^a   Lee, Sang Hun ^a   Lim, Hyung Taek ^a   Kim, Yong Kweon ^a  

^a Seoul National University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; ETCHING; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR DEVICE MODELS; SOLUTIONS; SURFACE ROUGHNESS; THERMAL EFFECTS;

ANISOTROPIC BULK ETCHING;

SILICON WAFERS;

EID: 0030651461     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)