Substrate coupling in mixed-mode and RF integrated circuits

Proceedings of the Annual IEEE International ASIC Conference and Exhibit

Volumn , Issue , 1997, Pages 297-303

  Verghese, Nishath K ^a   Allstot, David J ^a  

^a CADENCE DESIGN SYSTEMS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; SUBSTRATES;

SUBSTRATE COUPLINGS;

APPLICATION SPECIFIC INTEGRATED CIRCUITS;

EID: 0030650394     PISSN: 10630988     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (24)