CMP profile simulation using an elastic model based on nonlinear contact analysis

International Conference on Simulation of Semiconductor Processes and Devices, SISPAD

Volumn , Issue , 1997, Pages 69-72

  Kim, Yoo Hyon ^a   Kim, Tai Kyung ^a   Lee, Hoong Joo ^a   Kong, Jeong Taek ^a   Lee, Sang Hoon ^a  

^a SAMSUNG Electronics   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL POLISHING; COMPUTER SIMULATION; INTEGRATED CIRCUIT LAYOUT; MATHEMATICAL MODELS; PHOTOLITHOGRAPHY;

CHEMICAL MECHANICAL POLISHING; ELASTIC MODEL; NONLINEAR CONTACT ANALYSIS;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0030648896     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)