Toughened, inorganic-organic hybrid materials for microelectronic application

Materials Research Society Symposium - Proceedings

Volumn 443, Issue , 1997, Pages 47-58

  Hedrick, J L ^a   Srinivasan, S ^a   Cha, H J ^a   Yoon, D ^a   Flores, V ^a   Harbison, M ^a   Di Pietro, R ^a   Hinsberg, W ^a   Deline, V ^a   Brown, H R ^a   Sherwood, M ^a   Paulson, E ^a   Miller, R D ^a   Cook, R ^a   Liniger, E ^a  

^a IBM ALMADEN RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK PROPAGATION; GLASS; MICROELECTRONICS; OLIGOMERS; PERMITTIVITY; PLASTIC FILMS; POLYESTERS; POLYIMIDES; SEMICONDUCTING FILMS; SILICATES; STRESSES; TOUGHENING;

OLIGOMERIC SILSESQUIOXANES;

SEMICONDUCTING POLYMERS;

EID: 0030648622     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (17)