|
|
Volumn 478, Issue , 1997, Pages 139-144
|
|
Microstructure, mechanical properties, and thermoelectric properties of hot-extruded p-type Te-doped Bi0.5Sb1.5Te3 compounds
a
|
|
Author keywords
[No Author keywords available]
|
|
Indexed keywords
BENDING STRENGTH;
COMPOSITION EFFECTS;
CRYSTAL MICROSTRUCTURE;
CRYSTAL ORIENTATION;
DISLOCATIONS (CRYSTALS);
EXTRUSION;
RECRYSTALLIZATION (METALLURGY);
SEMICONDUCTING TELLURIUM;
SEMICONDUCTOR DOPING;
THERMAL EFFECTS;
THERMOELECTRICITY;
BISMUTH ANTIMONY TELLURIDE;
FIGURE OF MERIT;
SEMICONDUCTING BISMUTH COMPOUNDS;
|
|
EID: 0030648612
PISSN: 02729172
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1557/proc-478-139 Document Type: Conference Paper |
|
Times cited : (2)
|
|
References (4)
|
