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Volumn 2, Issue , 1997, Pages 1477-1480
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Capacitive differential pressure sensor with high overload capability using silicon/glass technology
a
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Author keywords
[No Author keywords available]
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Indexed keywords
BONDING;
COMPUTER SIMULATION;
FINITE ELEMENT METHOD;
HYDROSTATIC PRESSURE;
LIQUIDS;
OPTIMIZATION;
SANDWICH STRUCTURES;
ANODIC BONDING;
CAPACITIVE PRESSURE SENSOR;
DIFFERENTIAL PRESSURE;
SILICON GLASS TECHNOLOGY;
SENSORS;
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EID: 0030647221
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (5)
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References (4)
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