Thin film resistors and capacitors for advanced packaging

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn , Issue , 1997, Pages 71-74

  Kola, R R ^a   Lau, M Y ^a   Duenas, S ^a   Kumagai, H Y ^a   Smith, P R ^a   Frye, R C ^a   Tai, K L ^a   Sullivan, P A ^a  

^a NOKIA RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANODIC OXIDATION; CAPACITORS; COMPOSITION; DIELECTRIC FILMS; ELECTRIC BREAKDOWN; ELECTRIC VARIABLES MEASUREMENT; FILM PREPARATION; LEAKAGE CURRENTS; MICROSTRUCTURE; RESISTORS; THERMODYNAMIC STABILITY; THIN FILMS;

ADVANCED PACKAGING; CAPACITANCE DENSITY; TEMPERATURE COEFFICIENT OF CAPACITANCE; TEMPERATURE COEFFICIENT OF RESISTANCE;

ELECTRONICS PACKAGING;

EID: 0030644756     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (12)