Dispersive processes in the annealing of light- and thermally-induced dangling bonds in a-Si:H

Journal of Non-Crystalline Solids

Volumn 198-200, Issue PART 1, 1996, Pages 486-489

  Takeda, K ^a   Hikita, H ^a,b   Kimura, Y ^a,c   Yokomichi, H ^a,d   Morigaki, K ^a,e  

^a Electro Chemical and Cancer Institute   (Japan)

^b MEIKAI UNIVERSITY SCHOOL OF DENTISTRY   (Japan)

^c TOKAI UNIVERSITY   (Japan)

^d TOYAMA PREFECTURAL UNIVERSITY   (Japan)

^e HIROSHIMA INSTITUTE OF TECHNOLOGY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; CHEMICAL BONDS; LIGHT; REACTION KINETICS; THERMAL EFFECTS;

DISPERSIVE PROCESSES; HYDROGENATED AMORPHOUS SILICON; LIGHT INDUCED DANGLING BONDS; LIGHT SOAKING; STRETCHED EXPONENTIAL FUNCTION; THERMALLY INDUCED DANGLING BONDS;

AMORPHOUS SILICON;

EID: 0030563287     PISSN: 00223093     EISSN: None     Source Type: Journal    
DOI: 10.1016/0022-3093(95)00752-0     Document Type: Article

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