Cleaning of copper traces on circuit boards with excimer laser radiation

Applied Surface Science

Volumn 96-98, Issue , 1996, Pages 479-483

  Wesner, D A ^a   Mertin, M ^a   Lupp, F ^b   Kreutz, E W ^a  

^a RWTH AACHEN UNIVERSITY   (Germany)

^b SIEMENS AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; COPPER; EXCIMER LASERS; IRRADIATION; LASER PULSES; MORPHOLOGY; OPTICAL MICROSCOPY; PRINTED CIRCUIT BOARDS; PULSED LASER APPLICATIONS; SCANNING ELECTRON MICROSCOPY; SOLDERING; X RAY PHOTOELECTRON SPECTROSCOPY;

OPTICAL PROFILOMETRY; OPTICAL REFLECTIVITY; PULSED EXCIMER LASER RADIATION; SURFACE SEGREGATION;

SURFACE CLEANING;

EID: 0030563131     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/0169-4332(95)00499-8     Document Type: Article

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