Direct bonding of silicon wafers with a regular relief at the interface

Technical Physics Letters

Volumn 22, Issue 2, 1996, Pages 133-135

  Argunova, T S ^a   Andreev, A G ^a   Belyakova, E I ^a   Grekhov, I V ^a   Kostina, L S ^a   Kudryavtseva, T V ^a  

^a IOFFE INSTITUTE   (Russian Federation)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0030545609     PISSN: 10637850     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (6)

1. J. Haisma, G. A. C. M Spierings, U. K. P. Biermann, and J. A. Pals, Jpn. J. Appl. Phys. 28, 1426 (1989).
2. S. Bengtsson, J. Electron. Mater. 21, 841 (1992).
3. M. V. Volle, V. B. Voronkov, I. V. Grekhov, and V. A. Kozlov, Elektrolekhnika No. 2, 58 (1992).
4. I. V. Grekhov, E. I. Belyakova, L. S. Kostina, and I. A. Rol'nik, Pis'ma Zh. Tekh. Fiz. 19(23), 26 (1993) [Tech. Phys. Lett. 19, 748 (1993)].
5. I. V. Grekhov, E. I. Belyakova, L. S. Kostina, and I. A. Rol'nik, Pis'ma Zh. Tekh. Fiz. 19(23), 26 (1993) [Tech. Phys. Lett. 19, 748 (1993)].
6. I. V. Grekhov, E. I. Belyakova, L. S. Kostina, and I. A. Rol'nik, Proc. ISPSD, 1994, pp. 293-295.